Brian M. Foley

ScholarGPS® ID: 94767863950692

Affiliation History

Metrics Summary
Publication Count
53
Predicted Citations
2,778
Predicted h-index
27
Ranking

Publications and Citation History

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IEEE Transactions on Instrumentation and Measurement, volume 72 (2023).
Shi, Jingjing | Krishnan, Anusha | Bhuiyan, A. F. M. Anhar Uddin | Koh, Yee Rui | Huynh, Kenny | Mauze, Akhil | Mu, Sai | Foley, Brian M. | Ahmad, Habib | Itoh, Takeki | ... | Graham, Samuel
ASME 2021 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems (2021)
Virtual, Online
Song, Yiwen | Shoemaker, Daniel | Leach, Jacob H. | McGray, Craig | Huang, Hsien-Lien | Bhattacharyya, Arkka | Zhang, Yingying | Gonzalez-Valle, C. Ulises | Hess, Tina | Zhukovsky, Sarit | ... | Choi, Sukwon
ACS Applied Materials & Interfaces, volume 13, issue 34, pages 40817-40829 (2021).
2020 19th IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (ITherm) (2020)
Orlando, FL, USA
Chatterjee, Bikramjit | Lundh, James Spencer | Song, Yiwen | Shoemaker, Daniel | Baca, Albert G. | Kaplar, Robert J. | Beechem, Thomas E. | Saltonstall, Christopher | Allerman, Andrew A. | Armstrong, Andrew M. | ... | Choi, Sukwon
IEEE Electron Device Letters, volume 41, issue 3, pages 461-464 (2020).