Brian M. Foley
ScholarGPS® ID: 94767863950692
Affiliation History
Discipline
Mechanical Engineering
Top Specialties
Plasma (physics) | Electric Power | Metal-organic Compound | Metal–organic Framework | Photonics | Thermal Analysis
Metrics Summary
Publication Count
53
Predicted Citations
2,778
Predicted h-index
27
Ranking
Publications and Citation History
Publications based on Top Specialties
Types of Publication
- Publications
- Books
- Patents
- NIH/NSF
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AIP Advances, volume 13, issue 10 (2023). |
Sodium molybdate‐hexagonal boron nitride composites enabled by cold sintering for microwave dielectric substrates (journal article) Journal of the American Ceramic Society, volume 106, issue 10, pages 5975-5985 (2023). |
Journal of Applied Physics, volume 133, issue 11 (2023). |
IEEE Transactions on Instrumentation and Measurement, volume 72 (2023). |
Gate resistance thermometry: An electrical thermal characterization technique (book chapter) In Thermal Management of Gallium Nitride Electronics Elsevier (2022) |
ASME 2021 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems (2021) Virtual, Online |
Ga2 O3 -on-SiC Composite Wafer for Thermal Management of Ultrawide Bandgap Electronics (journal article) ACS Applied Materials & Interfaces, volume 13, issue 34, pages 40817-40829 (2021). |
Thermal Conductivity of β-Phase Ga2 O3 and (AlGa1– )2 O3 Heteroepitaxial Thin Films (journal article) ACS Applied Materials & Interfaces, volume 13, issue 32, pages 38477-38490 (2021). |
Diamond-Incorporated Flip-Chip Integration for Thermal Management of GaN and Ultra-Wide Bandgap RF Power Amplifiers (journal article) IEEE Transactions on Components, Packaging and Manufacturing Technology, volume 11, issue 8, pages 1177-1186 (2021). |
2021 ASEE Virtual Annual Conference Content Access (2021) Virtual Conference |
Thermal Conductivity of Aluminum Scandium Nitride for 5G Mobile Applications and Beyond (journal article) ACS Applied Materials & Interfaces, volume 13, issue 16, pages 19031-19041 (2021). |
Steady-state methods for measuring in-plane thermal conductivity of thin films for heat spreading applications (journal article) Review of Scientific Instruments, volume 92, issue 4 (2021). |
Broadband Dielectric Characterization from 10 mHz to 100 GHz of a 3D Printable Material (book chapter) In Broadband Dielectric Spectroscopy: A Modern Analytical Technique American Chemical Society (2021) |
The Doping Dependence of the Thermal Conductivity of Bulk Gallium Nitride Substrates (journal article) Journal of Electronic Packaging, volume 142, issue 4 (2020). |
Characterization of the Thermal Boundary Resistance of a Ga2 O3 /4H-SiC Composite Wafer (conference) 2020 19th IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (ITherm) (2020) Orlando, FL, USA |
Achieving Minimal Heat Conductivity by Ballistic Confinement in Phononic Metalattices (journal article) ACS Nano, volume 14, issue 4, pages 4235-4243 (2020). |
ACS Applied Electronic Materials, volume 2, issue 4, pages 980-991 (2020). |
IEEE Electron Device Letters, volume 41, issue 3, pages 461-464 (2020). |
Multidimensional thermal analysis of an ultrawide bandgap AlGaN channel high electron mobility transistor (journal article) Applied Physics Letters, volume 115, issue 15 (2019). |
Tunable Thermal Energy Transport across Diamond Membranes and Diamond–Si Interfaces by Nanoscale Graphoepitaxy (journal article) ACS Applied Materials & Interfaces, volume 11, issue 20, pages 18517-18527 (2019). |