Mohd Izrul Izwan Ramli

ScholarGPS® ID: 85130218453705

Affiliation

Universiti Malaysia Perlis, Kangar and Arau, Perlis, Malaysia

Affiliation History

Field

Engineering and Computer Science

Discipline

Chemical Engineering

Top Specialties

Metrics Summary

Publication Count

Predicted Citations

414

Predicted h-index

Ranking

Publications and Citation History

Publications based on Top Specialties

Types of Publication

Publications
Books
Patents
NIH/NSF

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MICROSTRUCTURE AND INTERFACIAL INTERMETALLIC OF Sn-3.0Ag-0.5Cu/Sn-58Bi SOLDER JOINT FOR PACKAGE-ON-PACKAGE TECHNOLOGY (journal article) Ramli, Mohd Izrul Izwan \| Mohd Said, Rita \| Somidin, Flora \| Muhd Amli, Siti Farahnabilah \| Mustapha, Siti Nor Atirah European Journal of Materials Science and Engineering, volume 8, issue 2, pages 69-73 (2023). 10.36868/ejmse.2023.08.02.069 Cite \| Source
OPTIMIZATION OF HOT AIR SOLDER LEVELING (HASL) MACHINE FOR A ROBUST SURFACE FINISH IN SOLDERING APPLICATIONS (journal article) Ramli, Mohd Izrul Izwan \| Muhd Amli, Siti Farahnabilah \| Saud, Norainiza \| Che Halin, Dewi Suriyani \| Md Fauzi, Nur Akrimi Maswa European Journal of Materials Science and Engineering, volume 8, issue 1, pages 30-35 (2023). 10.36868/ejmse.2023.08.01.030 Cite \| Source
Effect of Isothermal Aging on Mechanical Properties of Sn–0.7Cu–xZn Lead-Free Solder (book chapter) In Proceedings of the Green Materials and Electronic Packaging Interconnect Technology Symposium Ramli, Mohd Izrul Izwan \| Baser, Muhammad Fadlin Hazim \| Mohamad Zaimi, Nur Syahirah \| Tan, Chi Ying Springer Nature Singapore (2023) 10.1007/978-981-19-9267-4_2 Cite \| Source
Effect of Sb Addition to the Solidification and Microstructure of Sn–Ag–Cu Alloys (book chapter) In Proceedings of the Green Materials and Electronic Packaging Interconnect Technology Symposium Ramli, Mohd Izrul Izwan \| A’isyah, Mohd Suhami \| Azani, Azliza \| Mohamad Zaimi, Nur Syahirah Springer Nature Singapore (2023) 10.1007/978-981-19-9267-4_3 Cite \| Source
Effect of Al Addition to the Solidification and Microstructure Formation on Sn–Ag–Cu Solder Alloy (book chapter) In Proceedings of the Green Materials and Electronic Packaging Interconnect Technology Symposium Ramli, Mohd Izrul Izwan \| Saim, Ain Najihah \| Mohamad Zaimi, Nur Syahirah Springer Nature Singapore (2023) 10.1007/978-981-19-9267-4_1 Cite \| Source
Proceedings of the Green Materials and Electronic Packaging Interconnect Technology Symposium (book) Springer Nature Singapore (2023) 10.1007/978-981-19-9267-4 Cite \| Source
Liquid/Solid Interaction of Sn-58Bi/Sn-3.0Ag-0.5Cu Dissimilar Joints during Soldering at Low Temperature by In-Situ Synchrotron Imaging (journal article) Ramli, M. I. I. \| Salleh, M. A. A. Mohd \| Nishimura, T. \| Yasuda, H. \| Zaimi, N. S. Mohamad \| Nogita, K. JOM, volume 74, issue 7, pages 2760-2769 (2022). 10.1007/s11837-022-05229-9 Cited by (3) \| Cite \| Source
Effects of immersion silver (ImAg) and immersion tin (ImSn) surface finish on the microstructure and joint strength of Sn-3.0Ag-0.5Cu solder (journal article) Amli, S. F. Muhd \| Salleh, M. A. A. Mohd \| Ramli, M. I. I. \| Aziz, M. S. Abdul \| Yasuda, H. \| Chaiprapa, J. \| Nogita, K. Journal of Materials Science: Materials in Electronics, volume 33, issue 17, pages 14249-14263 (2022). 10.1007/s10854-022-08353-z Cited by (2) \| Cite \| Source
The Influence of Sintering Temperature on the Pore Structure of an Alkali-Activated Kaolin-Based Geopolymer Ceramic (journal article) Ramli, Mohd Izrul Izwan \| Salleh, Mohd Arif Anuar Mohd \| Abdullah, Mohd Mustafa Al Bakri \| Aziz, Ikmal Hakem \| Ying, Tan Chi \| Shahedan, Noor Fifinatasha \| Kockelmann, Winfried \| Fedrigo, Anna \| Sandu, Andrei Victor \| Vizureanu, Petrica \| ... \| Burduhos Nergis, Dumitru Doru Materials, volume 15, issue 7, pages 2667- (2022). 10.3390/ma15072667 Cited by (22) \| Cite \| Source
Effect of Kaolin Geopolymer Ceramics Addition on the Microstructure and Shear Strength of Sn-3.0Ag-0.5Cu Solder Joints during Multiple Reflow (journal article) Zaimi, Nur Syahirah Mohamad \| Salleh, Mohd Arif Anuar Mohd \| Abdullah, Mohd Mustafa Al-Bakri \| Nadzri, Nur Izzati Muhammad \| Sandu, Andrei Victor \| Vizureanu, Petrica \| Ramli, Mohd Izrul Izwan \| Nogita, Kazuhiro \| Yasuda, Hideyuki \| Sandu, Ioan Gabriel Materials, volume 15, issue 8, pages 2758- (2022). 10.3390/ma15082758 Cited by (3) \| Cite \| Source
The effect of Ni on the growth morphology of primary β-phase in an In-35 wt%Sn alloy (journal article) Chang, M.S. \| Salleh, M.A.A. Mohd \| Halin, D.S.C. \| Ramli, M.I.I. \| Yasuda, H. \| Nogita, K. Journal of Alloys and Compounds, volume 897 (2022). 10.1016/j.jallcom.2021.163172 Cited by (7) \| Cite \| Source
Formation and Growth of Intermetallic Compounds in Lead-Free Solder Joints: A Review (journal article) Ramli, Mohd Izrul Izwan \| Salleh, Mohd Arif Anuar Mohd \| Abdullah, Mohd Mustafa Al Bakri \| Zaimi, Nur Syahirah Mohamad \| Sandu, Andrei Victor \| Vizureanu, Petrica \| Rylski, Adam \| Amli, Siti Farahnabilah Muhd Materials, volume 15, issue 4, pages 1451- (2022). 10.3390/ma15041451 Cited by (19) \| Cite \| Source
Recent Studies in the Development of Ceramic-Reinforced Lead-Free Composite Solder (book chapter) In Recent Progress in Lead-Free Solder Technology Saud, Norainiza \| Mohd Salleh, Mohd Arif Anuar \| Mohd Said, Rita \| Somidin, Flora \| Mohamad Zaimi, Nur Syahirah \| Ramli, Mohd Izrul Izwan Springer International Publishing (2022) 10.1007/978-3-030-93441-5_1 Cite \| Source
Development of Geopolymer Ceramic-Reinforced Solder (book chapter) In Recent Progress in Lead-Free Solder Technology Abdullah, Mohd Mustafa Al Bakri \| Salleh, Mohd Arif Anuar Mohd \| Zulkifli, Nur Nadiah Izzati \| Zaimi, Nur Syahirah Mohamad \| Ahmad, Romisuhani \| Jamil, Noorina Hidayu \| Aziz, Ikmal Hakem \| Ramli, Mohd Izrul Izwan Springer International Publishing (2022) 10.1007/978-3-030-93441-5_2 Cite \| Source
Mixed Assembly of Lead-free Solder Joint: A Short Review (journal article) Said, Rita Mohd \| Salleh, Mohd Arif Anuar Mohd \| Ramli, Mohd Izrul Izwan \| Saud, Norainiza \| Somidin, Flora \| Razak, Nurul Razliana Abdul \| Ismail, Anis Nadhirah Journal of Physics: Conference Series, volume 2169, issue 1, pages 012039- (2022). 10.1088/1742-6596/2169/1/012039 Cited by (2) \| Cite \| Source
Synthesis of Kaolin Geopolymer as Ceramic Reinforcement in Lead-Free Solder (journal article) Mohamad Zaimi, Nur Syahirah \| Izwan Ramli, Mohd Izrul \| Mohd Salleh, Mohd Arif Anuar \| Bakri Abdullah, Mohd Mustafa Al \| Chaiprapa, Jitrin \| Abdul Aziz, Mohd Shahrizal Journal of Physics: Conference Series, volume 2169, issue 1, pages 012019- (2022). 10.1088/1742-6596/2169/1/012019 Cite \| Source
Influence of Fly Ash Geopolymer Ceramic Powder Addition on Sn-3.0Ag-0.5Cu Solder Joints (journal article) Somidin, Flora \| Natasha Ilias, Nur Fatin \| Mohamad Zaimi, Nur Syahirah \| Izwan Ramli, Mohd Izrul \| Abdul Razak, Nurul Razliana Journal of Physics: Conference Series, volume 2169, issue 1, pages 012032- (2022). 10.1088/1742-6596/2169/1/012032 Cited by (1) \| Cite \| Source
International Conference on Electronic and Advanced Materials 2021 (journal article) Saud, Norainiza \| Bakar, Sharifah Shahnaz Syed \| Ramli, Mohd Izrul Izwan \| Nazeri, Muhammad Firdaus Mohd Journal of Physics: Conference Series, volume 2169, issue 1, pages 011001- (2022). 10.1088/1742-6596/2169/1/011001 Cite \| Source
Influence of 1.5 wt.% Bi on the Microstructure, Hardness, and Shear Strength of Sn-0.7Cu Solder Joints after Isothermal Annealing (journal article) Ramli, Mohd Izrul Izwan \| Salleh, Mohd Arif Anuar Mohd \| Sandu, Andrei Victor \| Amli, Siti Farahnabilah Muhd \| Said, Rita Mohd \| Saud, Norainiza \| Abdullah, Mohd Mustafa Al Bakri \| Vizureanu, Petrica \| Rylski, Adam \| Chaiprapa, Jitrin \| Nabialek, Marcin Materials, volume 14, issue 18, pages 5134- (2021). 10.3390/ma14185134 Cited by (3) \| Cite \| Source
Effect of Electromigration and Thermal Ageing on the Tin Whiskers’ Formation in Thin Sn–0.7Cu–0.05Ga Lead (Pb)-Free Solder Joints (journal article) Mokhtar, Noor Zaimah Mohd \| Salleh, Mohd Arif Anuar Mohd \| Sandu, Andrei Victor \| Ramli, Muhammad Mahyiddin \| Chaiprapa, Jitrin \| Vizureanu, Petrica \| Ramli, Mohd Izrul Izwan Coatings, volume 11, issue 8, pages 935- (2021). 10.3390/coatings11080935 Cited by (9) \| Cite \| Source