Liqiang Cao | Scholar Profiles and Rankings

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Effects of neutron irradiation on failure behavior analysis of high-density bumps under thermo-coupling conditions (journal article) Jing, Xinyi \| Luo, Keyu \| Cao, Liqiang \| Paik, Kyung-Wook \| He, Peng \| Zhang, Shuye Materials Science in Semiconductor Processing, volume 177 (2024). 10.1016/j.mssp.2024.108386 Cite \| Source
Simulation and Experimental Verification of Moisture Diffusion in Embedded Component Packages (journal article) Shi, Binjie \| Su, Meiying \| Ma, Rui \| Chen, Chuan \| You, Xiangan \| Ding, Fei \| Wang, Qidong \| Cao, Liqiang IEEE Transactions on Components, Packaging and Manufacturing Technology, volume 14, issue 6, pages 1036-1042 (2024). 10.1109/TCPMT.2024.3396996 Cite \| Source
Sintering Mechanism Analysis of Cu Nanoparticles via Molecular Dynamics (conference) Hou, Fengze \| Ge, Honglin \| Sun, Zhanxing \| Zhou, Yunyan \| You, Xiangan \| Su, Meiying \| Chen, Chuan \| Wang, Qidong \| Cao, Liqiang 2024 25th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE) (2024) Catania, Italy 10.1109/EuroSimE60745.2024.10491437 Cite \| Source
Research progress of hybrid bonding technology for three-dimensional integration (journal article) Zhou, Anqi \| Zhang, Yu \| Ding, Fei \| Lian, Ziqi \| Jin, Renxi \| Yang, Yudong \| Wang, Qidong \| Cao, Liqiang Microelectronics Reliability, volume 155 (2024). 10.1016/j.microrel.2024.115372 Cited by (1) \| Cite \| Source
Review of Die-Attach Materials for SiC HighTemperature Packaging (journal article) Hou, Fengze \| Sun, Zhanxing \| Su, Meiying \| Fan, Jiajie \| You, Xiangan \| Li, Jun \| Wang, Qidong \| Cao, Liqiang \| Zhang, Guoqi IEEE Transactions on Power Electronics (2024). 10.1109/TPEL.2024.3417529 Cite \| Source
High-linearity graphene-based temperature sensor fabricated by laser writing (journal article) Zhang, Yong \| Zhao, Changhong \| Yu, Chen \| Li, Yi \| Guo, Xiaohui \| Zhang, Yan \| Chen, Chuan \| Cao, Liqiang Journal of Materials Science: Materials in Electronics, volume 35, issue 2 (2024). 10.1007/s10854-023-11841-5 Cited by (2) \| Cite \| Source
Lignin-based silicone-modified epoxy resin with enhanced strength and toughness (journal article) Li, Gang \| Li, Chaohua \| Li, Peiying \| Sun, Rong \| Cao, Liqiang \| Zhu, Pengli International Journal of Adhesion and Adhesives, volume 128 (2024). 10.1016/j.ijadhadh.2023.103564 Cited by (2) \| Cite \| Source
Comparison of Different Cooling Schemes for AlGaN/GaN High-Electron Mobility Transistors (journal article) Song, Yunqian \| Chen, Chuan \| Wang, Qidong \| Feng, Jianyu \| Fu, Rong \| Zhang, Xiaobin \| Cao, Liqiang Micromachines, volume 15, issue 1, pages 33- (2023). 10.3390/mi15010033 Cite \| Source
The Design Of Broadband W-Band Slot-Coupled Microstrip Patch Antenna (conference) Gan, HanChen \| Zhou, YunYan \| Zhang, WenWen \| Yang, ChenLin \| Song, Gang \| Lan, SiQi \| Li, Jun \| Cao, LiQiang 2023 IEEE 11th Asia-Pacific Conference on Antennas and Propagation (APCAP) (2023) Guangzhou, China 10.1109/APCAP59480.2023.10470009 Cite \| Source
Effects of Block Copolymer Terminal Groups on Toughening Epoxy-Based Composites: Microstructures and Toughening Mechanisms (journal article) Li, Gang \| Wu, Wenjie \| Yu, Xuecheng \| Zhang, Ruoyu \| Sun, Rong \| Cao, Liqiang \| Zhu, Pengli Micromachines, volume 14, issue 11, pages 2112- (2023). 10.3390/mi14112112 Cited by (1) \| Cite \| Source
A Novel Circular Position Sensitive Detector for Continuously High-Precision Angle Measurement (conference) Meng, Xiangxu \| Sun, Siwei \| Yan, Xuetao \| Yang, Peng \| Liu, Fengman \| Cao, Liqiang 2023 24th International Conference on Electronic Packaging Technology (ICEPT) (2023) Shihezi City, China 10.1109/ICEPT59018.2023.10492146 Cite \| Source
Non-wet Simulation and risk prediction of 2.5D Package (conference) Huang, Qianjin \| Xu, Cheng \| Su, Meiying \| Dai, Fengwei \| Sun, Peng \| Cao, Liqiang 2023 24th International Conference on Electronic Packaging Technology (ICEPT) (2023) Shihezi City, China 10.1109/ICEPT59018.2023.10492410 Cite \| Source
Comparative analysis of different microfluidic cooling technologies for high performance chips (conference) Feng, Jianyu \| Chen, Chuan \| Fu, Rong \| Cao, Liqiang 2023 24th International Conference on Electronic Packaging Technology (ICEPT) (2023) Shihezi City, China 10.1109/ICEPT59018.2023.10491892 Cite \| Source
Numerical Simulation of Solder Ball and RDL on Fan-Out Wafer Level Package under Random Vibration (conference) Yang, Shuai \| Xu, Cheng \| Su, Meiying \| Dai, Fengwei \| Sun, Peng \| Cao, Liqiang 2023 24th International Conference on Electronic Packaging Technology (ICEPT) (2023) Shihezi City, China 10.1109/ICEPT59018.2023.10491993 Cite \| Source
High Temperature Storage Simulation and Strain Analysis of Solder Ball in Fan-Out Wafer Level Package (FOWLP) (conference) Su, Peng \| Xu, Cheng \| Su, Meiying \| Dai, Fengwei \| Sun, Peng \| Cao, Liqiang 2023 24th International Conference on Electronic Packaging Technology (ICEPT) (2023) Shihezi City, China 10.1109/ICEPT59018.2023.10492217 Cite \| Source
Quantitative analysis of the interface strength of ultra-thin dielectric films based on fan-out packaging (conference) Sun, Zhanxing \| Ding, Fei \| Ma, Rui \| Wang, Qidong \| Jing, Xiangmeng \| Su, Meiying \| Cao, Liqiang 2023 24th International Conference on Electronic Packaging Technology (ICEPT) (2023) Shihezi City, China 10.1109/ICEPT59018.2023.10492268 Cite \| Source
High-efficiency and low-loss thin film lithium niobate modulator (conference) Yang, Peng \| Liu, Fengman \| Sun, Siwei \| Xue, Haiyun \| Meng, Xiangxu \| Cao, Liqiang 2023 24th International Conference on Electronic Packaging Technology (ICEPT) (2023) Shihezi City, China 10.1109/ICEPT59018.2023.10492256 Cite \| Source
Facile Preparation of Monodisperse Cu@Ag Core–Shell Nanoparticles for Conductive Ink in Printing Electronics (journal article) Li, Gang \| Yu, Xuecheng \| Zhang, Ruoyu \| Ouyang, Qionglin \| Sun, Rong \| Cao, Liqiang \| Zhu, Pengli Micromachines, volume 14, issue 7, pages 1318- (2023). 10.3390/mi14071318 Cited by (1) \| Cite \| Source
Long‐distance and anti‐disturbance wireless power transfer based on concentric three‐coil resonator and inhomogeneous electromagnetic metamaterials (journal article) An, Huilin \| Yuan, Jian \| Li, Jun \| Cao, Liqiang International Journal of Circuit Theory and Applications, volume 51, issue 5, pages 2030-2045 (2023). 10.1002/cta.3531 Cited by (5) \| Cite \| Source
Development of a Novel Fabrication Process for Application in Glass Gas Electron Multiplier Detectors (journal article) Wu, Xiaomeng \| Sun, Xilei \| Cao, Liqiang \| Wang, Qidong Processes, volume 11, issue 4, pages 1215- (2023). 10.3390/pr11041215 Cited by (1) \| Cite \| Source