Robert J. Kaplar
ScholarGPS® ID: 69637196264229
Affiliation History
Discipline
Electrical and Computer Engineering
Top Specialties
Electric Power | Semiconductor | Power Electronics | Power Semiconductor Device | Mobilities | Electron Mobility | High-electron-mobility Transistor | High Voltage | Capacitor | Photovoltaics | Light-emitting Diode | Power (physics) | Gallium Nitride | Reliability Engineering | Semiconductor Device
Metrics Summary
Publication Count
205
Predicted Citations
2,734
Predicted h-index
31
Ranking
Publications and Citation History
Publications based on Top Specialties
Types of Publication
- Publications
- Books
- Patents
- NIH/NSF
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Suppression of Enhanced Magnesium Diffusion During High‐Pressure Annealing of Implanted GaN (journal article) physica status solidi (a) (2024). |
2024 IEEE International Reliability Physics Symposium (IRPS) (2024) Grapevine, TX, USA |
Detecting defects that reduce breakdown voltage using machine learning and optical profilometry (journal article) Scientific Reports, volume 14, issue 1 (2024). |
Single-event burnout in homojunction GaN vertical PiN diodes with hybrid edge termination design (journal article) Applied Physics Letters, volume 124, issue 13 (2024). |
Optimization of Step-Etched Junction Termination Extensions for Vertical GaN Devices (journal article) IEEE Transactions on Electron Devices, volume 71, issue 3, pages 1541-1545 (2024). |
A Review of GaN HEMT Dynamic ON-Resistance and Dynamic Stress Effects on Field Distribution (journal article) IEEE Transactions on Power Electronics, volume 39, issue 1, pages 517-537 (2024). |
Improving vertical GaN p–n diode performance with room temperature defect mitigation (journal article) Semiconductor Science and Technology, volume 39, issue 1, pages 015004- (2024). |
(Invited) Advanced Design Concepts for Vertical Gallium Nitride MOSFETs (journal article) ECS Meeting Abstracts, volume MA2023-02, issue 35, pages 1679-1679 (2023). |
(Invited) In-Situ MOCVD Etching of GaN Using XeF2 for Selective-Area-Epitaxial-Regrowth of p-Type GaN for High Voltage PN Diodes (journal article) ECS Meeting Abstracts, volume MA2023-02, issue 35, pages 1688-1688 (2023). |
Co-optimization Design and Analysis of WBG and UWBG Power Diodes with Operational Regimes (conference) 2023 IEEE 10th Workshop on Wide Bandgap Power Devices & Applications (WiPDA) (2023) Charlotte, NC, USA |
Etch Depth Study for Step-Etched Junction Termination Extensions in Vertical GaN Devices (conference) 2023 IEEE 10th Workshop on Wide Bandgap Power Devices & Applications (WiPDA) (2023) Charlotte, NC, USA |
Study of anode doping and avalanche in foundry compatible 1.2 kV vertical GaN PiN diodes (journal article) Applied Physics Express, volume 16, issue 11, pages 116501- (2023). |
Novel Dynamic ON-Resistance Measurement Circuit Topology, Operation, and Performance for High Voltage GaN Power HEMTs (conference) 2023 IEEE Energy Conversion Congress and Exposition (ECCE) (2023) Nashville, TN, USA |
Journal of Applied Physics, volume 134, issue 12 (2023). |
Machine Learning Based Non-Intrusive Inspection Technique to Quantify GaN HEMT Characteristics (conference) 2023 IEEE Design Methodologies Conference (DMC) (2023) Miami, FL, USA |
Gate protection for vertical gallium nitride trench MOSFETs: The buried field shield (journal article) e-Prime - Advances in Electrical Engineering, Electronics and Energy, volume 5 (2023). |
Overview of Wide/Ultrawide Bandgap Power Semiconductor Devices for Distributed Energy Resources (journal article) IEEE Journal of Emerging and Selected Topics in Power Electronics, volume 11, issue 4, pages 3957-3982 (2023). |
Microstructural evolution of extended defects in 25 μ m thick GaN homo-epitaxial layers (journal article) Applied Physics Letters, volume 122, issue 24 (2023). |
Multi-Objective Parametric Analysis of EV Traction Inverter between Reliability and Efficiency (conference) 2023 IEEE Applied Power Electronics Conference and Exposition (APEC) (2023) Orlando, FL, USA |
Cascaded SiC JFET Topology for High-Voltage Solid-State Circuit Breaker Applications (journal article) IEEE Transactions on Industry Applications, volume 59, issue 2, pages 2326-2339 (2023). |