Trung T. Doan | Scholar Profiles and Rankings

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Light emitting diode (patent) Doan, Trung-Tri \| Cheng, Chao-Chen \| Shih, Yi-Feng Patent Number: 9231152 (2016) Cite \| Source
Smart integrated semiconductor light emitting system including nitride based light emitting diodes (LED) and application specific integrated circuits (ASIC) (patent) Doan, Trung Tri \| Tan, Tien Wei \| Liu, Wen-Huang \| Chu, Chen-Fu \| Chen, Yung Wei Patent Number: 8933467 (2015) Cited by (1) \| Cite \| Source
Method for fabricating semiconductor dice by separating a substrate from semiconductor structures using multiple laser pulses (patent) Chu, Chen-Fu \| Cheng, Hao-Chung \| Doan, Trung Tri \| Fan, Feng-Hsu Patent Number: 8921204 (2014) Cite \| Source
Method for fabricating vertical light emitting diode (VLED) structure using a laser pulse to remove a carrier substrate (patent) Chu, Chen-Fu \| Liu, Wen-Huang \| Chu, Jiunn-Yi \| Cheng, Chao-Chen \| Cheng, Hao-Chun \| Fan, Feng-Hsu \| Doan, Trung Tri Patent Number: 8871547 (2014) Cited by (12) \| Cite \| Source
Lighting device comprising LEDs with phosphor layers (patent) Liu, Wen-Huang \| Doan, Trung-Tri \| Tran, Chuong-Anh Patent Number: 8835953 (2014) Cited by (2) \| Cite \| Source
Method of fabricating semiconductor die using handling layer (patent) Chu, Chen-Fu \| Doan, Trung Tri \| Cheng, Hao-Chun \| Fan, Feng-Hsu \| Wang, Fu-Hsien Patent Number: 8802469 (2014) Cite \| Source
Method for handling a semiconductor wafer assembly (patent) Doan, Trung Tri \| Chu, Chen-Fu Patent Number: 8802465 (2014) Cited by (1) \| Cite \| Source
Method for defining semiconductor devices (patent) Doan, Trung-Tri \| Chu, Chen-Fu \| Cheng, Hao-Chun \| Fan, Feng-Hsu Patent Number: 8778780 (2014) Cited by (1) \| Cite \| Source
Light emitting diode (LED) die having recessed electrode and light extraction structures and method of fabrication (patent) Chu, Jiunn-Yi \| Doan, Trung Tri Patent Number: 8759128 (2014) Cite \| Source
Light emitting diode (LED) die having peripheral electrode frame and method of fabrication (patent) Chu, Chen-Fu \| Fan, Feng-Hsu \| Cheng, Hao-Chun \| Doan, Trung Tri Patent Number: 8723160 (2014) Cited by (1) \| Cite \| Source
Method for fabricating side by side light emitting diode (LED) having separate electrical and heat transfer paths (patent) Doan, Trung Tri \| Chu, Chen-Fu \| Liu, Wen-Huang \| Fan, Feng-Hsu \| Cheng, Hao-Chun \| Wang, Fu-Hsien Patent Number: 8716041 (2014) Cited by (1) \| Cite \| Source
Method to make low resistance contact (patent) Chu, Chen-Fu \| Liu, Wen-Huang \| Chu, Jiunn-Yi \| Cheng, Chao-Chen \| Cheng, Hao-Chun \| Fan, Feng-Hsu \| Doan, Trung Tri Patent Number: 8685764 (2014) Cited by (14) \| Cite \| Source
Vertical light emitting diodes (LED) having metal substrate and spin coated phosphor layer for producing white light (patent) Tran, Chuong A \| Doan, Trung Tri Patent Number: 8680534 (2014) Cite \| Source
Protection for the epitaxial structure of metal devices (patent) Cheng, Chao-Chen \| Chu, Chen-Fu \| Tran, Chuong Anh \| Fan, Feng-Hsu \| Cheng, Hao-Chun \| Chu, Jiunn-Yi \| Yen, Jui-Kang \| Doan, Trung Tri \| Liu, Wen-Huang Patent Number: 8614449 (2013) Cite \| Source
Side by side light emitting diode (LED) having separate electrical and heat transfer paths (patent) Chu, Chen-Fu \| Fan, Feng-Hsu \| Wang, Fu-Hsien \| Cheng, Hao-Chun \| Doan, Trung Tri \| Liu, Wen-Huang Patent Number: 8552458 (2013) Cited by (1) \| Cite \| Source
Light-emitting diode with increased light extraction (patent) Tran, Chuong Anh \| Doan, Trung Tri Patent Number: 8552451 (2013) Cite \| Source
Methods and systems for controlling temperature during microfeature workpiece processing, E.G., CVD deposition (patent) Basceri, Cem \| Kubista, David J. \| Ping, Er-Xuan \| Beaman, Kevin L. \| Zheng, Lingyi A. \| Breiner, Lyle D. \| Weimer, Ronald A. \| Doan, Trung T. Patent Number: 8518184 (2013) Cite \| Source
Wall structures for a semiconductor wafer (patent) Chu, Chen-Fu \| Fan, Feng-Hsu \| Cheng, Hao-Chun \| Doan, Trung Tri Patent Number: 8507302 (2013) Cited by (4) \| Cite \| Source
Method for fabricating semiconductor dice by separating a substrate from semiconductor structures using multiple laser pulses (patent) Chu, Chen-Fu \| Cheng, Hao-Chung \| Doan, Trung Tri \| Fan, Feng-Hsu Patent Number: 20130302926 (2013) Cite \| Source
Light emitting diode (LED) package having wavelength conversion member and wafer level fabrication method (patent) Yen, Jui- Kang \| Doan, Trung Tri Patent Number: 8410508 (2013) Cited by (2) \| Cite \| Source