Hideyuki Yasuda

ScholarGPS® ID: 67065375070087

Affiliation

Kyoto University, Kyoto, Japan

Affiliation History

Field

Engineering and Computer Science

Discipline

Materials Science and Engineering

Top Specialties

Metrics Summary

Publication Count

188

Predicted Citations

4,093

Predicted h-index

Ranking

Publications and Citation History

Publications based on Top Specialties

Types of Publication

Publications
Books
Patents
NIH/NSF

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Solidification microstructures of V-Nb-Mo-Ta-W alloys: Insights from non-equiatomic alloys (journal article) Katsube, Ryoji \| Tokuri, Shigehiro \| Nakano, Keita \| Narumi, Taka \| Yasuda, Hideyuki Journal of Alloys and Compounds, volume 981 (2024). 10.1016/j.jallcom.2024.173656 Cited by (1) \| Cite \| Source
In Situ Observation of the Ga- and Cu-Based Substrate Reaction by Synchrotron Microradiography (journal article) Hao, Qichao \| Tan, Xin Fu \| Liu, Shiqian \| McDonald, Stuart D. \| Yasuda, Hideyuki \| Nogita, Kazuhiro ACS Applied Electronic Materials, volume 5, issue 12, pages 7004-7014 (2023). 10.1021/acsaelm.3c01383 Cite \| Source
Contribution of Ni microalloying to Cu dissolution in In–35Sn/Cu solder joints after multiple reflows (journal article) Chang, M.S. \| Mohd Salleh, M.A.A. \| Halin, D.S.C. \| Somidin, F. \| Yasuda, H. \| Nogita, K. Journal of Materials Research and Technology, volume 26 (2023). 10.1016/j.jmrt.2023.09.139 Cited by (2) \| Cite \| Source
The effectiveness of Ni microalloying on the microstructure and mechanical properties of low temperature In-35 wt%Sn/Cu solder joint (journal article) Chang, M.S. \| Mohd Salleh, M.A.A. \| Somidin, F. \| Halin, D.S.C. \| Yasuda, H. \| Nogita, K. Materials Science and Engineering: A, volume 882 (2023). 10.1016/j.msea.2023.145457 Cited by (7) \| Cite \| Source
Solidification sequence of CrMnFeCoCu dual-FCC multicomponent alloy (journal article) Katsube, Ryoji \| Luo, Litian \| Nakano, Keita \| Narumi, Taka \| Yasuda, Hideyuki Scripta Materialia, volume 231 (2023). 10.1016/j.scriptamat.2023.115459 Cited by (1) \| Cite \| Source
Effects of Multiple Reflow on the Formation of Primary Crystals in Sn-3.5Ag and Solder Joint Strength: Experimental and Finite Element Analysis (journal article) Amli, Siti Farahnabilah Muhd \| Salleh, Mohd Arif Anuar Mohd \| Aziz, Mohd Sharizal Abdul \| Yasuda, Hideyuki \| Nogita, Kazuhiro \| Abdullah, Mohd Mustafa Al Bakri \| Nemes, Ovidiu \| Sandu, Andrei Victor \| Vizureanu, Petrica Materials, volume 16, issue 12, pages 4360- (2023). 10.3390/ma16124360 Cite \| Source
Nucleation and growth of Ag3Sn in Sn-Ag and Sn-Ag-Cu solder alloys (journal article) Cui, Y. \| Xian, J.W. \| Zois, A. \| Marquardt, K. \| Yasuda, H. \| Gourlay, C.M. Acta Materialia, volume 249 (2023). 10.1016/j.actamat.2023.118831 Cited by (23) \| Cite \| Source
Ag3Sn Morphology Transitions During Eutectic Growth in Sn–Ag Alloys (journal article) Hou, N. \| Xian, J. W. \| Sugiyama, A. \| Yasuda, H. \| Gourlay, C. M. Metallurgical and Materials Transactions A, volume 54, issue 3, pages 909-927 (2023). 10.1007/s11661-022-06937-2 Cited by (8) \| Cite \| Source
Data assimilation for dendritic solidification with melt convection: phase-field lattice Boltzmann study (journal article) Yamamura, Ayano \| Sakane, Shinji \| Ohno, Munekazu \| Yasuda, Hideyuki \| Takaki, Tomohiro IOP Conference Series: Materials Science and Engineering, volume 1274, issue 1, pages 012044- (2023). 10.1088/1757-899X/1274/1/012044 Cited by (1) \| Cite \| Source
Benchmark Experiment to Evaluate Macrosegregation Generated by Bridging and Solidification Shrinkage Flow (journal article) Natsume, Yukinobu \| Sasaki, Muneto \| Narumi, Taka \| Yasuda, Hideyuki \| Esaka, Hisao ISIJ International, volume 63, issue 7, pages 1114-1121 (2023). 10.2355/isijinternational.ISIJINT-2022-492 Cited by (1) \| Cite \| Source
Data assimilation with phase-field lattice Boltzmann method for dendrite growth with liquid flow and solid motion (journal article) Yamamura, Ayano \| Sakane, Shinji \| Ohno, Munekazu \| Yasuda, Hideyuki \| Takaki, Tomohiro Computational Materials Science, volume 215 (2022). 10.1016/j.commatsci.2022.111776 Cited by (11) \| Cite \| Source
Liquid/Solid Interaction of Sn-58Bi/Sn-3.0Ag-0.5Cu Dissimilar Joints during Soldering at Low Temperature by In-Situ Synchrotron Imaging (journal article) Ramli, M. I. I. \| Salleh, M. A. A. Mohd \| Nishimura, T. \| Yasuda, H. \| Zaimi, N. S. Mohamad \| Nogita, K. JOM, volume 74, issue 7, pages 2760-2769 (2022). 10.1007/s11837-022-05229-9 Cited by (3) \| Cite \| Source
Effects of immersion silver (ImAg) and immersion tin (ImSn) surface finish on the microstructure and joint strength of Sn-3.0Ag-0.5Cu solder (journal article) Amli, S. F. Muhd \| Salleh, M. A. A. Mohd \| Ramli, M. I. I. \| Aziz, M. S. Abdul \| Yasuda, H. \| Chaiprapa, J. \| Nogita, K. Journal of Materials Science: Materials in Electronics, volume 33, issue 17, pages 14249-14263 (2022). 10.1007/s10854-022-08353-z Cited by (2) \| Cite \| Source
Properties of Sn-3 wt%Ag-5 wt%Cu alloys with Cu6Sn5 intermetallics grain refined by Mg (journal article) Tan, C.Y. \| Salleh, M.A.A. Mohd \| Tan, X.F. \| Yasuda, H. \| Saud, N. \| Ramli, M.I.I. \| Nogita, K. Materials Today Communications, volume 31 (2022). 10.1016/j.mtcomm.2022.103221 Cited by (9) \| Cite \| Source
Effect of Kaolin Geopolymer Ceramics Addition on the Microstructure and Shear Strength of Sn-3.0Ag-0.5Cu Solder Joints during Multiple Reflow (journal article) Zaimi, Nur Syahirah Mohamad \| Salleh, Mohd Arif Anuar Mohd \| Abdullah, Mohd Mustafa Al-Bakri \| Nadzri, Nur Izzati Muhammad \| Sandu, Andrei Victor \| Vizureanu, Petrica \| Ramli, Mohd Izrul Izwan \| Nogita, Kazuhiro \| Yasuda, Hideyuki \| Sandu, Ioan Gabriel Materials, volume 15, issue 8, pages 2758- (2022). 10.3390/ma15082758 Cited by (3) \| Cite \| Source
The effect of Ni on the growth morphology of primary β-phase in an In-35 wt%Sn alloy (journal article) Chang, M.S. \| Salleh, M.A.A. Mohd \| Halin, D.S.C. \| Ramli, M.I.I. \| Yasuda, H. \| Nogita, K. Journal of Alloys and Compounds, volume 897 (2022). 10.1016/j.jallcom.2021.163172 Cited by (7) \| Cite \| Source
Understanding the Rheological Transitions in Semi-Solid Alloys by a Combined <i>In Situ</i> Imaging and Granular Micromechanics Modeling Approach (journal article) Su, Te Cheng \| O'Sullivan, Catherine \| Yasuda, Hideyuki \| Gourlay, Christopher M. Solid State Phenomena, volume 327 (2022). 10.4028/www.scientific.net/SSP.327.127 Cite \| Source
Investigation on the Solidification and Phase Transformation in Pb-Free Solders Using In Situ Synchrotron Radiography and Diffraction: A Review (journal article) Zeng, Guang \| Liu, Shiqian \| Gu, Qinfen \| Zheng, Zebang \| Yasuda, Hideyuki \| McDonald, Stuart D. \| Nogita, Kazuhiro Acta Metallurgica Sinica (English Letters), volume 35, issue 1, pages 49-66 (2022). 10.1007/s40195-021-01350-x Cited by (2) \| Cite \| Source
Effect of Ni, Zn, Au, Sb and In on the Suppression of the Cu3Sn Phase in Sn-10 wt.%Cu Alloys (journal article) Mehreen, Syeda U. \| Nogita, Kazuhiro \| McDonald, Stuart D. \| Yasuda, Hideyuki \| StJohn, David H. Journal of Electronic Materials, volume 50, issue 3, pages 881-892 (2021). 10.1007/s11664-020-08709-3 Cited by (4) \| Cite \| Source
Two-dimensional phase-field study for spangle texture formation in hot-dip galvanizing (journal article) Takaki, Tomohiro \| Wada, Koki \| Ishii, Kotaro \| Yasuda, Hideyuki Computational Materials Science, volume 187 (2021). 10.1016/j.commatsci.2020.110077 Cited by (4) \| Cite \| Source