Salman Akram | Scholar Profiles and Rankings

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Laser de-bond carrier wafer from device wafer (patent) Zou, Quanbo \| Akram, Salman \| Bhat, Jerome Chandra \| Trieu, Minh Ngoc \| Blank, Robert Patent Number: 10741718 (2020) Cite \| Source
Elevated pocket pixels, imaging devices and systems including the same and method of forming the same (patent) Akram, Salman Patent Number: 10504948 (2019) Cite \| Source
Hybrid gate dielectrics for semiconductor power devices (patent) Akram, Salman \| Ananthan, Venkat Patent Number: 10490644 (2019) Cite \| Source
Semiconductor devices comprising nickel— and copper—containing interconnects (patent) Akram, Salman \| Wark, James M. \| Hiatt, William Mark Patent Number: 10446440 (2019) Cite \| Source
Elevated pocket pixels, imaging devices and systems including the same and method of forming the same (patent) Akram, Salman Patent Number: 10181486 (2019) Cited by (1) \| Cite \| Source
Semiconductor devices comprising nickel- and copper-containing interconnects (patent) Akram, Salman \| Wark, James M. \| Hiatt, William Mark Patent Number: 10062608 (2018) Cited by (1) \| Cite \| Source
LED with stress-buffer layer under metallization layer (patent) Akram, Salman \| Zou, Quanbo Patent Number: 10050180 (2018) Cite \| Source
Hybrid gate dielectrics for semiconductor power devices (patent) Akram, Salman \| Ananthan, Venkat Patent Number: 10002941 (2018) Cite \| Source
Methods for transferring heat from stacked microfeature devices (patent) Akram, Salman \| Hembree, David R. Patent Number: 9960148 (2018) Cite \| Source
Elevated pocket pixels, imaging devices and systems including the same and method of forming the same (patent) Akram, Salman Patent Number: 9911769 (2018) Cite \| Source
Method of attaching a light emitting device to a support substrate (patent) Steigerwald, Daniel Alexander \| Bhat, Jerome Chandra \| Akram, Salman Patent Number: 9705047 (2017) Cite \| Source
Chip scale light emitting device package with dome (patent) Akram, Salman \| Bhardwaj, Jyoti Kiron Patent Number: 9660154 (2017) Cite \| Source
Methods of forming interconnects and semiconductor structures (patent) Akram, Salman \| Wark, James M. \| Hiatt, William Mark Patent Number: 9640433 (2017) Cite \| Source
LED with stress-buffer layer under metallization layer (patent) Akram, Salman \| Zou, Quanbo Patent Number: 9640729 (2017) Cite \| Source
Elevated pocket pixels, imaging devices and systems including the same and method of forming the same (patent) Akram, Salman Patent Number: 9437762 (2016) Cited by (2) \| Cite \| Source
Method of attaching a light emitting device to a support substrate (patent) Steigerwald, Daniel Alexander \| Bhat, Jerome Chandra \| Akram, Salman Patent Number: 9431581 (2016) Cite \| Source
Chip scale light emitting device with metal pillars in a molding compound formed at wafer level (patent) Lei, Jipu \| Schiaffino, Stefano \| Nickel, Alexander H. \| Ng, Mooi Guan \| Basin, Grigoriy \| Akram, Salman Patent Number: 9406857 (2016) Cite \| Source
Method of bonding a semiconductor device to a support substrate (patent) Zou, Quanbo \| Akram, Salman \| Bhat, Jerome Chanra Patent Number: 9343612 (2016) Cite \| Source
Wafer-level packaged microelectronic imagers having interconnects formed through terminals (patent) Akram, Salman \| Benson, Peter A. \| Farnworth, Warren M. \| Hiatt, William M. Patent Number: 8816463 (2014) Cite \| Source
Elevated pocket pixels, imaging devices and systems including the same and method of forming the same (patent) Akram, Salman Patent Number: 8816405 (2014) Cited by (3) \| Cite \| Source