Menglong Li
ScholarGPS® ID: 37661500745452
Affiliation History
Discipline
Computer Science
Top Specialties
Electronic Packaging
Metrics Summary
Publication Count
9
Predicted Citations
85
Predicted h-index
5
Ranking
Publications and Citation History
Publications based on Top Specialties
Types of Publication
- Publications
- Books
- Patents
- NIH/NSF
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Wide-range soft anisotropic thermistor with a direct wireless radio frequency interface (journal article) Nature Communications, volume 15, issue 1 (2024). |
Finite element analysis (FEA) modelling and experimental verification to optimise flexible electronic packaging for e-textiles (journal article) Microsystem Technologies, volume 28, issue 6, pages 1515-1524 (2022). |
Integration and Testing of a Three-Axis Accelerometer in a Woven E-Textile Sleeve for Wearable Movement Monitoring (journal article) Sensors, volume 20, issue 18, pages 5033- (2020). |
Processing of Printed Dye Sensitized Solar Cells on Woven Textiles (journal article) IEEE Journal of Photovoltaics, volume 9, issue 4, pages 1020-1024 (2019). |
Novel Electronic Packaging Method for Functional Electronic Textiles (journal article) IEEE Transactions on Components, Packaging and Manufacturing Technology, volume 9, issue 2, pages 216-225 (2019). |
Functional Electronic Textiles: Circuit Integration and Energy Harvesting Power Supplies (conference) 2018 International Flexible Electronics Technology Conference (IFETC) (2018) Ottawa, ON |
The thickness and material optimization of flexible electronic packaging for functional electronic textile (conference) 2018 Symposium on Design, Test, Integration & Packaging of MEMS and MOEMS (DTIP) (2018) Roma |
Stress Analysis and Optimization of a Flip Chip on Flex Electronic Packaging Method for Functional Electronic Textiles (journal article) IEEE Transactions on Components, Packaging and Manufacturing Technology, volume 8, issue 2, pages 186-194 (2018). |
Stress Analysis of Flexible Packaging for the Integration of Electronic Components within Woven Textiles (conference) 2017 IEEE 67th Electronic Components and Technology Conference (ECTC) (2017) Orlando, FL, USA |