Bikramjit Chatterjee
ScholarGPS® ID: 31052606338635
Affiliation History
Discipline
Mechanical Engineering
Top Specialties
Electric Power | Electron Mobility | Electronic Packaging
Metrics Summary
Publication Count
22
Predicted Citations
681
Predicted h-index
13
Ranking
Publications and Citation History
Publications based on Top Specialties
Types of Publication
- Publications
- Books
- Patents
- NIH/NSF
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Thermally-Aware Layout Design of β -Ga₂O₃ Lateral MOSFETs (journal article) IEEE Transactions on Electron Devices, volume 69, issue 3, pages 1251-1257 (2022). |
AlGaN/GaN HEMT device physics and electrothermal modeling (book chapter) In Thermal Management of Gallium Nitride Electronics Elsevier (2022) |
Thermal design of multi-fin Ga2O3 vertical transistors (journal article) Applied Physics Letters, volume 119, issue 10 (2021). |
Diamond-Incorporated Flip-Chip Integration for Thermal Management of GaN and Ultra-Wide Bandgap RF Power Amplifiers (journal article) IEEE Transactions on Components, Packaging and Manufacturing Technology, volume 11, issue 8, pages 1177-1186 (2021). |
2021 20th IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (iTherm) (2021) San Diego, CA, USA |
Electro-Thermal Investigation of GaN Vertical Trench MOSFETs (journal article) IEEE Electron Device Letters, volume 42, issue 5, pages 723-726 (2021). |
Electro-thermal co-design of β -(AlxGa1-x)2O3/Ga2O3 modulation doped field effect transistors (journal article) Applied Physics Letters, volume 117, issue 15 (2020). |
Characterization of the Thermal Boundary Resistance of a Ga2 O3 /4H-SiC Composite Wafer (conference) 2020 19th IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (ITherm) (2020) Orlando, FL, USA |
Guidelines for Reduced-Order Thermal Modeling of Multifinger GaN HEMTs (journal article) Journal of Electronic Packaging, volume 142, issue 2 (2020). |
ACS Applied Electronic Materials, volume 2, issue 4, pages 980-991 (2020). |
Nanoscale electro-thermal interactions in AlGaN/GaN high electron mobility transistors (journal article) Journal of Applied Physics, volume 127, issue 4 (2020). |
IEEE Transactions on Components, Packaging and Manufacturing Technology, volume 9, issue 12, pages 2352-2365 (2019). |
Correlated Effects of Self-Heating, Light Output, and Efficiency of GaN Light-Emitting Diodes on Junction Temperature (conference) ASME 2019 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems (2019) Anaheim, California, USA |
Multidimensional thermal analysis of an ultrawide bandgap AlGaN channel high electron mobility transistor (journal article) Applied Physics Letters, volume 115, issue 15 (2019). |
Polarization modulation effect of BeO on AlGaN/GaN high-electron-mobility transistors (journal article) Applied Physics Letters, volume 115, issue 10 (2019). |
Thermal Management and Characterization of High-Power Wide-Bandgap Semiconductor Electronic and Photonic Devices in Automotive Applications (journal article) Journal of Electronic Packaging, volume 141, issue 2 (2019). |
2019 18th IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (ITherm) (2019) Las Vegas, NV, USA |
Thermal characterization of gallium oxide Schottky barrier diodes (journal article) Review of Scientific Instruments, volume 89, issue 11 (2018). |
Temperature and Stress Metrology of Ultra-Wide Bandgap β-Ga<inf>2</inf>O<inf>3</inf> Thin Films (conference) 2018 17th IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (ITherm) (2018) San Diego, CA |
Improved Light Output Power of 16 × 16 Pixelated Micro‐LEDs for Headlights by Enhancing the Reflectivity and Coverage of the p ‐Electrode (journal article) physica status solidi (a), volume 215, issue 10 (2018). |