Alan G. Wood

ScholarGPS® ID: 22042725114151

Affiliation
Micron Technology, Inc., Boise, United States
Affiliation History

Field
Engineering and Computer Science
Discipline
Electrical and Computer Engineering
Top Specialties
Semiconductor | Semiconductor Device | Manufacturing | Semiconductor Package | Microelectronics | Polymer | Flip Chip | Laser | Integrated Circuit | Ultrasound | Energy | Flexible Electronics | Electrical Connector | Optical Instrument | Image Sensor
Metrics Summary
Publication Count
445
Predicted Citations
24,546
Predicted h-index
87
Ranking

Publications and Citation History

Publications based on Top Specialties

Types of Publication

  • Publications
  • Books
  • Patents
  • NIH/NSF
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Semiconductor constructions (patent)
Wood, Alan G. | Ireland, Philip J.
Patent Number: 10121738 (2018)
Cite | Source
Semiconductor constructions having through-substrate interconnects (patent)
Wood, Alan G. | Ireland, Philip J.
Patent Number: 9583419 (2017)
Cite | Source
Semiconductor module system having encapsulated through wire interconnect (TWI) (patent)
Hembree, David R | Wood, Alan G.
Patent Number: 9018751 (2015)
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Through wire interconnect (TWI) for semiconductor components having wire in via and bonded connection with substrate contact (patent)
Wood, Alan G | Hembree, David R
Patent Number: 9013044 (2015)
Cited by (2) | Cite | Source
Methods of forming through-substrate interconnects (patent)
Wood, Alan G. | Ireland, Philip J.
Patent Number: 8853072 (2014)
Cited by (1) | Cite | Source
Semiconductor constructions having through-substrate interconnects (patent)
Wood, Alan G. | Ireland, Philip J.
Patent Number: 20150130029 (2014)
Cite | Source
Method of forming vias in semiconductor substrates and resulting structures (patent)
Watkins, Charles M. | Kirby, Kyle K. | Wood, Alan G. | Akram, Salman | Farnworth, Warren M.
Patent Number: 8786097 (2014)
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Method for fabricating a through wire interconnect (TWI) on a semiconductor substrate having a bonded connection and an encapsulating polymer layer (patent)
Hembree, David R | Wood, Alan G.
Patent Number: 8741667 (2014)
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Method for fabricating semiconductor components having lasered features containing dopants (patent)
Wood, Alan G. | Corbett, Tim
Patent Number: 8728921 (2014)
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Methods for wafer-level packaging of microfeature devices and microfeature devices formed using such methods (patent)
Farnworth, Warren M. | Wood, Alan G.
Patent Number: 8704380 (2014)
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Through-wafer interconnects for photoimager and memory wafers (patent)
Akram, Salman | Watkins, Charles M. | Hiatt, William M. | Hembree, David R. | Wark, James M. | Farnworth, Warren M. | Tuttle, Mark E. | Rigg, Sidney B. | Oliver, Steven D. | Kirby, Kyle K. | ... | Velicky, Lu
Patent Number: 8669179 (2014)
Cited by (3) | Cite | Source
Through wire interconnect (TWI) having bonded connection and encapsulating polymer layer (patent)
Wood, Alan G. | Hembree, David R.
Patent Number: 8581387 (2013)
Cited by (2) | Cite | Source
Stacked semiconductor components having conductive interconnects (patent)
Wood, Alan G. | Hembree, David R. | Hiatt, William M.
Patent Number: 8546931 (2013)
Cited by (2) | Cite | Source
Thinned semiconductor components having lasered features and method of fabrication (patent)
Wood, Alan G. | Corbett, Tim
Patent Number: 8530895 (2013)
Cite | Source
Stacked semiconductor component having through wire interconnect (TWI) with compressed wire (patent)
Wood, Alan G. | Hembree, David R.
Patent Number: 8513797 (2013)
Cited by (3) | Cite | Source
METHOD FOR FABRICATING SEMICONDUCTOR COMPONENTS HAVING LASERED FEATURES CONTAINING DOPANTS (patent)
Wood, Alan G. | Corbett, Tim J.
Patent Number: 20130323909 (2013)
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Through-wafer interconnects for photoimager and memory wafers (patent)
Wood, Alan G. | Watkins, Charles M. | Hembree, David R. | Wark, James M. | Kirby, Kyle K. | Velicky, Lu | Tuttle, Mark E. | Akram, Salman | Rigg, Sidney B. | Oliver, Steven D. | ... | Hiatt, William M.
Patent Number: 8502353 (2013)
Cited by (3) | Cite | Source
Through wire interconnect (TWI) for semiconductor components having wire in via and bonded connection with substrate contact (patent)
Wood, Alan G. | Hembree, David R.
Patent Number: 20130299983 (2013)
Cite | Source
Microelectronic device wafers and methods of manufacturing (patent)
Wood, Alan G. | Schrock, Ed A. | Grigg, Ford B.
Patent Number: 8455983 (2013)
Cite | Source
Method for fabricating stacked semiconductor system with encapsulated through wire interconnects (TWI) (patent)
Wood, Alan G. | Hembree, David R.
Patent Number: 8404523 (2013)
Cited by (5) | Cite | Source