Xiang Zhang

ScholarGPS® ID: 13725142320618

Affiliation History

Metrics Summary
Publication Count
12
Predicted Citations
78
Predicted h-index
5
Ranking

Publications and Citation History

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2017 IEEE 26th Conference on Electrical Performance of Electronic Packaging and Systems (EPEPS) (2017)
San Jose, CA
2016 IEEE 25th Conference on Electrical Performance of Electronic Packaging and Systems (EPEPS) (2016)
San Diego, CA, USA
2015 ACM/IEEE International Workshop on System Level Interconnect Prediction (SLIP) (2015)
San Francisco, CA, USA
IEEE Transactions on Components, Packaging and Manufacturing Technology, volume 4, issue 8, pages 1325-1334 (2014).
2014 IEEE International Symposium on Parallel and Distributed Processing with Applications (ISPA) (2014)
Milan, Italy
SLIP '14: System Level Interconnect Prediction Workshop (2014)
San Francisco CA USA
2013 IEEE 22nd Conference on Electrical Performance of Electronic Packaging and Systems (EPEPS) (2013)
San Jose, CA, USA
2013 ACM/IEEE International Workshop on System Level Interconnect Prediction (SLIP) (2013)
Austin, TX, USA